Like a fine jeweler, we craft your diamond from rough with our “four C’s”.
 
  Capability
  • Combined experience of fifty plus years in product development and delivery
  • A multitude of existing designs from which to draw.
   Capacity
  • A demonstrated ability to perform on volume production in support of military programs.
  • Established outsourcing processes and suppliers to accommodated volume and/or quick turn requirements.
   Control
  • MIL-I-45208 compliant quality system
   Care
  • Open dialog with customers is appreciated and often requested
  • We are motivated by the knowledge that each customer is important to us.

Images with brief descriptions of our design, manufacturing, and screening equipment.
Substrate Etch
Quickturn around prototype,and/or short-run softboard circuits.
Eutectic Substrate Attach
Performed in a reducing atmosphere without the use flux.
Micro Soldering
Static-free workstations with instant implementation of updates and changes.
 
Eutectic Die Attach

Epoxy Die Attach
Product design dictates process.
Epoxy Cure
Controlled ovens
In-Process Device Testing
Probestation
Manual Wire Bonders
Automatic Wire Bonders
Small run and volume manufacturing.
 

Bond Process Control -Destructive and Non-Destructive bond-pull testing
 
Epoxy Seal -Computer controlled liquid dispensing
RF Alignment - Test equipment covering DC through 40 GHz.
Thermal Stress Screening -Auto thermal cycle / shock chambers
 
Vibration Stress Screening -Random and sinusoidal profiles
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