Like a fine jeweler, we craft your diamond from rough with our “four C’s”.
Capability
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Capacity
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Control
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Care
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Images with brief descriptions of our design, manufacturing, and screening equipment. | Substrate Etch Quickturn around prototype,and/or short-run softboard circuits. |
Eutectic Substrate Attach Performed in a reducing atmosphere without the use flux. |
Micro Soldering Static-free workstations with instant implementation of updates and changes. |
Eutectic Die Attach |
Epoxy Die Attach Product design dictates process. |
Epoxy Cure Controlled ovens |
In-Process Device Testing Probestation |
Manual Wire Bonders |
Automatic Wire Bonders Small run and volume manufacturing. |
Bond Process Control -Destructive and Non-Destructive bond-pull testing |
Epoxy Seal -Computer controlled liquid dispensing |
RF Alignment - Test equipment covering DC through 40 GHz. |
Thermal Stress Screening -Auto thermal cycle / shock chambers |
Vibration Stress Screening -Random and sinusoidal profiles |