CAPABILITIES
Like a fine jeweler, we craft your diamond from rough with our “four C’s”.
Capability
- Combined experience of fifty plus years in product development and delivery
- A multitude of existing designs from which to draw.
Capacity
- A demonstrated ability to perform on volume production in support of military programs.
- Established outsourcing processes and suppliers to accommodated volume and/or quick turn requirements.
Control
- MIL-I-45208 compliant quality system
Care
- Open dialog with customers is appreciated and often requested
- We are motivated by the knowledge that each customer is important to us.
Design, Manufacturing, and Screening Equipment.
Substrate Etch
Quickturn around prototype,and/or short-run softboard circuits.
Eutectic Substrate Attach
Performed in a reducing atmosphere without the use flux.
Micro Soldering
Static-free workstations with instant updates and changes.
Eutectic Die Attach
Epoxy Die Attach
Product design dictates process.
Epoxy Cure
Controlled ovens
In-Process Device Testing
Probestation
Manual Wire Bonders
Automatic Wire Bonders
Automatic Wire Bonders
Small run and volume manufacturing.
Bond Process Control -
Destructive and Non-Destructive bond-pull testing
Epoxy Seal
Computer controlled liquid dispensing
RF Alignment - Test
equipment covering DC through 40 GHz.
Thermal Stress Screening
Auto thermal cycle / shock chambers
Vibration Stress Screening
Random and sinusoidal profiles